KEMET 薄膜電容器 RSBEC1330DQ00K
通用金屬化聚酯薄膜電容器RSB，5 毫米引線間距，50 – 630 VDC
RSB 由金屬化聚酯薄膜（堆疊技術(shù)）和鍍錫線徑向引線構(gòu)成。徑向引線電焊到電容器繞組
端部的接觸金屬層上。電容器用熱固性樹脂封裝在一盒符合
UL 94 V–0 要求的材料中。典型應(yīng)用包括高性能、高溫、阻塞、耦合、信號(hào)
從直流到高頻、脈沖、邏輯和定時(shí)電路的去耦
? 電壓范圍：50 – 630 VDC? 電容范圍：0.001 – 4.7 μF
? 引線間距：5 mm? 電容容差：±20%、±10% 標(biāo)準(zhǔn)、±5% 應(yīng)要求
? 氣候類別：55/125/56? ?55?C 至 +125?C 的工作溫度范圍
KEMET:
RSBDC3470AA10J RSBEC0100ZA00M RSBEC3200AA00J RSBEC4100ZA00J RSBMC1330DQ00K
RSBMC2470CK00J RSBPC1680ZA00K RSBEC1100ZA00K RSBPC1330SH00K RSBIC1330DQ00J
RSBEC1470SH00J RSBDC4150SH10K RSBPC1100AA00J RSBIC3150DQ00J RSBEC1470DQ00K
RSBMC2220JF00K RSBIC3100AA00M RSBEC2330Z300K RSBEC1150SW00J RSBIC3220ZB00K
RSBCC4220JB10M RSBDC4100DQ10K RSBDC4150DQ10K RSBDC4100CK10J RSBIC1100JA00K
RSBIC3100DQ00M RSBPC1390DQ00J RSBIC2680DQ00J RSBDC4150Z310K RSBEC2390DQ00J
RSBPC1150CK00J RSBEC1330DQ00J RSBEC3150DQ00K RSBPC1330AA00K RSBIC2390SH00J
RSBEC3470SH10J RSBEC2220DQ00J RSBDC3220Z310J RSBEC1100DQ00J RSBPC1330CK00J
RSBMC1330ZA00K RSBDC4100ZF00M RSBDC3120DQ00K RSBDC3100JA00K RSBPC2100DQ00J
RSBCC4150DQ00K RSBPC1680AA00K RSBDC4150SH10J RSBIC3100AA00K RSBEC3100DQ00J
RSBMC1470DQ00K RSBEC3330DQ00J RSBPC1220JH00K RSBMC1100FZ00K RSBEC2220SW00J
RSBDC3680SW10J RSBDC3100DQ00J RSBEC1470CK00K RSBCC4220DQ10K RSBMC1330DQ00J
RSBCC4150CZ00K RSBCC4220CZ10K RSBEC1470SW00K RSBEC2470CZ00K RSBPC21007705M
RSBCC4220Z310K RSBEC1680DQ00J RSBPC1470DQ00M RSBDC2820DQ00J RSBDC3680CK10J
RSBCC4220CK10K RSBWC1330DQ00K RSBIC2220DQ00K RSBEC2100CK00M RSBIC3100DQ00J
RSBMC1100DQ00K RSBIC1470Z300K RSBDC3470CZ10K RSBEC2680SH10J RSBEC1330DQ00K
RSBDC3180SH10J RSBIC2820SH00J RSBEC1470CK00J RSBDC4100CK10K RSBPC1240ZA00K
RSBDC3220SH10J RSBDC4150AA10J RSBPC1270DQ00K RSBDC3560DQ00K RSBDC4150AA10K
RSBDC3470DQ10K RSBDC4100AA00J RSBPC1180DQ00J RSBZC2470ZC00K RSBEC2820DQ00J
RSBDC3220CZ10K RSBMC1470AA00J RSBIC1470DQ00K RSBIC2470CK00M RSBDC3100AA00K